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Samsung Electronics shares rose 3%.A former employee of Adebio was sentenced and involved in AstraZeneca employees' insurance fraud case. A former employee of the genetic testing company Aidebio, which worked closely with AstraZeneca, committed medical insurance fraud together with AstraZeneca sales staff during his tenure in the company. He was sentenced to three years' imprisonment and fined for fraud, and I pleaded guilty. A judgment obtained shows that Ma, a former employee of Aide Bio involved in the case, conspired with AstraZeneca employees to tamper with the genetic test report during his tenure. He began to accept public security investigation in September 2021 and was sentenced in August 2023. However, on December 9, 2024, the company replied that "there is no problem (cooperation with AstraZeneca), which has no impact on us and has nothing to do with us" and denied that any employees were involved. (financial magazine)Korean media: South Korea's ruling party has added another person to support the impeachment of Yin Xiyue, and the number of members in favor has now increased to six. According to the latest news in Yonhap News Agency, Zhongwu Qin, a member of parliament of South Korea's ruling National Power Party, said on the 12th that he would vote for the impeachment of the president on the 14th. Yonhap News Agency said that so far, the number of members of the ruling party who have publicly expressed their support for the impeachment of President Yin Xiyue has increased to six.

Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)According to the data of Cat's Eye Professional Edition, the movie "Lone Star Project" was released for 6 days, and the total box office broke 70 million.The main contract of CSI 500 stock index futures (IC) expanded to 1.00% in the day and is now reported at 6104.4 points. The main contract of CSI 500 stock index futures (IC) stood at 6100 points, rising by 0.99% in the day.

The 10-year main contract of treasury bond futures rose in the afternoon, hitting a record high. The 10-year main contract of treasury bond futures rose in the afternoon and now rose by 0.17% to 108.335 yuan, hitting a record high. In addition, the 30-year main contract rose by 0.27%, the 5-year main contract rose by 0.07%, and the 2-year main contract rose by 0.03%.Market News: NVIDIA has increased its recruitment in China, focusing on artificial intelligence to drive cars.Pakistan KSE-100 index rose 1% to 112,128.50.